News
September 2007
Mintech Semiconductors Ltd forms centre of excellence under new ASC Group Europe ownership
Already a leading Global Die Distributor the expansion plan underway is in order to provide our expanding market with world class service. Capacity will be raised by over 30% to increase flexibility and ramp up both new and existing projects.
Equipment recently added:
200mm / 8" Fully Automated Disco Saw
Volume Wafer Mapping and Test Binning Equipment
Orthodyne Fine Pitch (30µm) Automation Wedge Bonder
Tape and Reel machine
DIMA Automatic Adhesive Dispenser
Real-time Oven Temperature Monitoring System
Expanded Clean Room with up-rated Environmental Controls
In conjunction with our other
ASC Group affiliated packaging company,
TS2 Micro; we are now one of the largest suppliers of Semiconductor die, Specialist Packaging and Testing under one roof.