Flip Chip & Stud Bump
As part of our growing capability in package assembly test and screening
Mintech Semiconductors Ltd is now able to offer flip chip assembly, using
un-bumped bare die.
Using a high-speed process we can stud bump bare die not only in volume but at
low cost. This unique process allows us to stud bump at any stage, on wafer
prior to saw, on singulated die, onto the substrate, flex or edge connector
ready for flip-chip attachment.
Why change the metalisation of the semiconductor to a non-standard metal?, when
stud bumps use standard wafer technology.
Maintaining flexibility, stud bumps have been demonstrated to work over the
majority of major manufacturer's die product.
Not only are stud bumps low cost, flexible, use standard metalisations, they
have technical advantages over most other methods.
- Low profile
- Low inductance
- Large choice of attachment techniques
- No obstruction to heat flow
- Ease of placement
- Co-planarity compensation
- Wafer or singulated die
For further information on these processes, please don't hesitate to contact us.